Our international client is currently searching for a Package Design Engineer to be responsible for completing all package design activities within the company and to complete package design reviews in conjunction with assembly subcons.
Liaising closely with IC layout engineers will be required as well as verifying electrical characteristics of the new package design. Ensuring cost effective methodologies are incorporated into the BGA substrate and lead-frame designs is an important factor.
Required skills for the Semiconductor Package Design Engineer will include:
* Semiconductor IC Package Design using Cadence APD / SIP experience
* Knowledge of IC Packaging technology including thermal and mechanical behaviour
* Strong interpersonal and communication skills.
* Managing communication with assembly subcontractors
* Degree qualified or equivalent
Please contact Rachel Anderson for further details.