This KTP offers the Associate a unique opportunity to apply cutting-edge numerical techniques and design concepts into a real-world setting. Beyond the technical requirements, the Associate will establish and coordinate a project group, oversee project deliverables, and support knowledge transfer and embedding project outputs with support from the OIPT R&D team, necessitating cross-departmental communication and management.
The Associate will develop a keen knowledge of the rapidly evolving SiC industry and will be responsible for managing timelines, budgets, and stakeholder expectations, requiring careful coordination and regular communication between academic, commercial, and executive team members.
The successful candidate will work between the UoA and OIPT’s R&D team. The position will primarily be based at OIPT’s premises in Bristol.
Salary will be at the appropriate point on Grade 6, off scale, between £38,000 – £41,000 per annum, with placement according to qualifications and experience. In addition, the Associate will benefit from a tax-free personal development budget of £5,000.
Informal enquiries should be made to Dr. Scott Doyle, Lecturer, Head of Plasma Science Research Group.
This 2.5-year (30-month) Knowledge Transfer Partnership (KTP), co-funded by Innovate UK and Oxford Instruments Plasma Technology (OIPT), will employ state-of-the-art numerical modelling techniques, combined with experimental verification, to assess and optimise plasma-assisted silicon carbide (SiC) wafer polishing processes in an industrial context.
The project aims to develop and validate a rapid, targeted cleaning process for plasma processing reactor tools to reduce equipment downtime and use of environmentally damaging materials. The transfer of plasma chemistry, modelling, and simulation capabilities, along with the creation of a digital model, will directly facilitate process optimisation and increase company market share.
The successful candidate, hereafter referred to as the Associate, will lead and manage detailed numerical assessments of complex plasma-surface interactions and subsequent carbon impurity generation, transport, and re-deposition in an OIPT plasma-assisted SiC polishing reactor. This will be facilitated by creating and verifying a plasma-surface chemical reaction mechanism and embedding it within an existing numerical framework.
The start date is flexible and will be agreed upon with the successful applicant.
About the business
Oxford Instruments Nanotechnology Tools Limited, trading as Oxford Instruments Plasma Technology (OIPT), is a leading provider of plasma etch and deposition processing equipment. OIPT’s tools (currently thousands worldwide) range from fully clustered cassette-to-cassette platforms for high-volume manufacturing (HVM) of compound semiconductor materials to single load-lock, stand-alone systems for R&D. OIPT offers solutions for plasma etching and deposition, ion beam etching and deposition, and atomic layer etching and deposition, as well as a library of over 8,000 plasma processing recipes, all essential for manufacturing advanced microelectronics. OIPT generates revenue through sales of plasma processing tools, development of customer-specific plasma processes, and support of these tools and processes.
The current objectives of OIPT are continued growth and increased market trust in the HVM sector through demonstrable improvement in understanding of OIPT tools.
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