Our international client is currently searching for a Staff Package Development Engineer to join their dynamic team in Edinburgh, UK. The role will involve working closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Liaising with overseas suppliers and cross functional teams will be required as well as ensuring new and existing package solutions meet thermal, electrical and mechanical requirements.
Required skills for the Staff NPI Package Development Engineer will include:
* Strong semiconductor packaging and reliability testing experience
* Knowledge/experience with FEA for mechanical and thermal analysis
* Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
* BSc or above in Mechanical, Electrical, Chemical, or Materials Engineering
Please contact Rachel Anderson for further details.