We are exclusively representing a high-profile leader in power electronics manufacturing that is expanding its engineering team by seeking a senior packaging design engineer.
The company produce a range of devices that are multi-application focused, involving GaN and SiC integration.
A position has arisen for an experienced back-end/packaging designer to spearhead this new packaging direction they are going in.
A summary of the responsibilities is below:
* Design and development of power module packaging for wide band gap semiconductor devices.
* Focus on low losses (electrical and thermal) and high reliability.
* Embedding power devices within multi-layered laminated material stacks to produce power modules with both high power density and low losses.
* Develop module designs with system-level architecture in mind.
* Consideration of capacitor integration, heat sink design/coolant flow integration, placement of gate drive boards and power busbars, etc.
A summary of the required experience is below:
* Embedded packaging experience
* Prior power module design experience is a key advantage
* Module packaging and integration of SiC or GaN
* Experience in the prediction of the right materials being used
* 2D + 3D modeling experence
* PCB design software experience
* Simulation experience is essential. Ideally, using Ansys.