We’re seeking a Senior Principal RF Manager to lead high‑speed signal/RF interface design and verification for next‑generation optical network platforms. You’ll own end‑to‑end RF architecture, compliance to OIF CEI specifications, simulation and modelling workflows (HFSS, S‑parameter/IBIS), and partner/supplier technical engagement. This role blends hands‑on technical leadership with strategic direction—ideal for someone who drives decisions through rigorous design, system‑level thinking, and iterative, agile development practices. You will also champion innovation across teams, introducing new methodologies, tools, and design approaches that elevate performance and accelerate time‑to‑market.
Key Responsibilities
RF Architecture, Design & Verification
* Own the high‑speed signal/RF interface design and verification across product lifecycle (concept → bringup → validation) using ambitious design to refine architecture and converge quickly on design decisions.
* Ensure compliance with OIF CEI specifications and related standards across lanes and link budgets for modules and interface cards.
* Lead HFSS based simulations, including transmission lines, transitions (vias, connectors), couplers, launch structures, and RF components.
* Develop and refine stack‑up, routing, impedance targets, and de‑embedding approaches for high‑density boards.
* Define measurement plans and tolerance analyses to validate against spec and environmental/aging conditions.
Modelling, Data & System Integration
* Collate and provide modelling inputs for optical network/system teams: generate/curate high‑quality Sparameter (S4P) files and IBIS/IBISAMI models with proper documentation, corners, and validation checks.
* Promote innovative modelling automation and data‑driven workflows that improve accuracy, repeatability, and productivity.
Test Structures & Evaluation
* Design and evaluate test structures to support product decisions and de‑risk manufacturing.
* Create DOE plans, acceptance criteria, and analysis templates to accelerate iteration and convergence.
* Apply agile experimentation principles—rapid prototyping, short feedback loops, and adaptive test planning.
Supplier & Partner Engagement
* Lead supplier engagement for PCB materials (e.g., low‑loss laminates), fabrication technologies (HDI, backdrilling, via‑in‑pad), and component selection (connectors, passives, RF components).
* Act as the technical interface to third‑party development partners on RF requirements, verification methodologies, and deliverables.
* Introduce innovative approaches to supplier collaboration, enabling early risk visibility and accelerated co‑development.
Team Collaboration & ElectroMechanical Integration
* Collaborate with mechanical, packaging, optics, and firmware teams to co‑optimize electromechanical designs (thermal relief, keepouts, connector placement, EMI/EMC mitigations).
* Contribute to DFM/DFT practices and testability of RF paths.
Leadership & Governance
* Provide technical mentoring to one to three direct reports and broader team members.
* Establish engineering standards, checklists, and review gates for RF design and verification.
* Report against deliverables and provide mitigation strategies.
* Own risk registers, mitigation plans, and clear communication of trade‑offs to stakeholders.
Required Qualifications & Experience
* 10–15+ years in RF/high‑speed digital design (SerDes, PAM4/NRZ, up to 56–224G lanes) with a delivery track record.
* Deep expertise in electromagnetic simulation (HFSS) for transmission lines, launch/transition optimization, and component modelling.
* Strong knowledge of OIF CEI electrical specs and compliance methodologies.
* Proficiency with Sparameter generation/processing (S4P), IBIS/IBISAMI, and model correlation to lab results.
* Hands‑on experience with VNA, TDR, high‑bandwidth scopes, and fixture/de‑embedding techniques (TRL/SOLT, time gating).
* Experience collaborating with PCB fabricators on materials (e.g., Megtron, Tachyon, I‑Speed), stack‑ups, via strategies, and manufacturing constraints.
* Excellent communication skills for cross‑functional leadership and partner engagement.
* Exposure to optical transceiver modules (QSFPDD/OSFP, copackaged optics) and backplane/interconnect design.
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