Overview:
Join a pioneering team focused on advancing the frontiers of photonics and optical system integration. Our client is an innovative, growth-stage company developing next-generation optical platforms for high-impact applications.
Role & Responsibilities:
* Lead the development and optimization of advanced packaging solutions for photonic devices, including design, process integration, and reliability testing.
* Collaborate cross-functionally with internal R&D, product development, and external manufacturing partners to deliver packaged optical modules to market.
* Drive technical problem-solving related to photonic packaging, including materials selection, thermal management, mechanical robustness, and optical integrity.
* Oversee external supplier and contract manufacturer (OSAT) relationships, including qualification, process development, and yield improvement initiatives.
* Support DFM (Design for Manufacturing), prototyping, and transition to high-volume manufacturing.
* Contribute to technical strategy discussions influencing future product architectures and technology roadmaps.
* Mentor junior engineers and support a culture of innovation and technical excellence.
Qualifications:
* Advanced degree (MSc/PhD preferred) in Photonics, Materials Science, Physics, Electrical Engineering, or a related field.
* 8+ years of experience in photonics or optoelectronics, with a strong focus on packaging engineering and module integration.
* Demonstrated track record of leading packaging design projects or managing complex programs in an industrial setting.
* Experience partnering with contract manufacturers or OSATs for packaging development and production.
* Solid understanding of optical, mechanical, and thermal considerations in photonic module/package design.
* Hands-on proficiency with prototyping, reliability testing, and quality control processes.
* Excellent communication and cross-functional collaboration skills.