Overview
Our international client is recruiting a Staff Package Design Engineer to join the team in Edinburgh. The role will involve working closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. The position requires using AutoCAD and Cadence SiP tools for electrical simulation and manufacturing validation of package designs. Working with cross-functional teams will be an important part of the role.
Responsibilities
* Collaborate with internal and external customers to develop packaging solutions for high-performance products (e.g., amplifiers, codecs, and DSPs).
* Utilize AutoCAD and Cadence SiP tools for electrical simulation and manufacturing validation of package designs.
* Work with cross-functional teams to deliver packaging solutions.
Qualifications
* Experienced Cadence SiP layout user
* Understanding of electrical simulation results on a package design
* Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
* BSc or above in Mechanical, Electrical, Chemical, or Materials Engineering
Location
Edinburgh, Scotland, United Kingdom
Seniority level
* Mid-Senior level
Employment type
* Full-time
Industry
* Semiconductor Manufacturing
Please contact Rachel Anderson for further details.
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