Do you want to join a company that doesn’t just connect the world, but reimagines how the world stays connected?
Join one of the most influential satellite and space communications innovators on the planet, powering global connectivity with a cutting‑edge multi‑orbit network that reaches nearly every corner of the globe; known for delivering rock‑solid video, broadband, mobility, and secure government communications at massive scale, trusted by more than 60 government organisations, eight of the top ten mobile network operators, and dozens of major airlines and enterprises, and recognised for driving breakthrough technologies from low‑latency medium earth orbit services to secure global data pathways that keep people, systems, and industries linked in real time.
Apply now to be part of a team at the forefront of space‑enabled connectivity, where your work fuels global communication, empowers critical missions, and pushes the boundaries of what’s possible!
Responsibilities
* PCB Design & Layout: Lead high-speed digital design, including schematic capture, layout, and Design for Manufacturability (DFM).
* Simulation & Analysis: Perform critical pre- and post‑layout Signal Integrity (SI), Power Integrity (PI), and thermal simulations.
* Subsystem Integration: Collaborate with architects to define board‑level requirements and high‑speed interfaces (DDR, PCIe, SERDES).
* Component Strategy: Select space‑qualified components, balancing radiation tolerance with obsolescence management.
* Testing & Debugging: Drive board bring‑up and functional testing, troubleshooting issues during environmental qualification.
* Supplier Coordination: Interface with manufacturers and assembly houses to ensure strict compliance with space‑grade standards.
* Design Governance: Prepare documentation and lead technical presentations for Preliminary and Critical Design Reviews (PDR/CDR).
Required Qualifications
* Education: Bachelor’s or Master’s degree in Electrical/Electronics Engineering.
* Experience: 5+ years in high‑speed digital PCB design, ideally within the aerospace or space sector.
* Technical Tools: Proficiency with professional ECAD suites (Altium Designer, Cadence Allegro, or Mentor Graphics).
* Domain Expertise: Deep understanding of impedance control, differential pair routing, and FPGA/microprocessor‑based designs.
* Space Standards: Familiarity with radiation‑hardened electronics and standards such as ECSS or IPC Class 3.
* Lab Skills: Hands‑on experience with oscilloscopes, logic analyzers, TDR, and EMC/EMI testing.
* Security: Must be eligible for "SECRET" level security clearance (EU/ESA/NATO equivalents).
Preferred Skills
* Experience with High‑Density Interconnect (HDI) design for space applications.
* Prior involvement in NGSO or MEO constellation programs.
* Knowledge of advanced thermal management techniques for high‑power digital boards.
Benefits
* Hybrid Working Model: Flexible onsite presence (minimum 60% onsite).
* Career Progression: Opportunities to grow within a pioneering aerospace team internalizing its supply chain.
* Comprehensive Package: Competitive salary and benefits aligned with senior aerospace engineering roles.
* Professional Development: Exposure to state‑of‑the‑art testing and manufacturing environments.
Salary
* €100,000
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