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Applications engineer (ai & hpc infrastructure)

Chesterfield
Pin Point Recruitment
Application engineer
Posted: 11 March
Offer description

Applications Engineer (AI & HPC Infrastructure)

Remote in the UK with some EU travel

Data Centre Infrastructure / Advanced Thermal Management

Salary on application

Permanent, full time contract


The rapid growth of AI, machine learning, and high-performance computing (HPC) is transforming the design of modern data centres. As power densities increase dramatically, advanced liquid cooling technologies are becoming essential to support the next generation of computing infrastructure. This is an excellent opportunity for an engineer who enjoys working directly with customers, solving complex technical challenges, and contributing to the adoption of innovative cooling technologies in one of the fastest-growing areas of the technology sector. You will be the technical interface between customers, sales teams, and internal engineering functions, supporting projects from early-stage design and solution development through installation, commissioning, and operational optimisation.


Key Responsibilities

* Provide pre-sales and post-sales technical support for liquid cooling solutions.
* Support customers with system architecture, sizing, and selection of cooling technologies.
* Review customer mechanical, thermal, and hydraulic designs and provide engineering recommendations.
* Conduct thermal and hydraulic analysis to validate system performance.
* Support pilot projects, proof-of-concept deployments, and field trials.
* Assist commercial teams with technical proposals, RFQs, and RFP responses.
* Deliver technical presentations, workshops, and customer training.
* Provide support during installation, commissioning, and troubleshooting.
* Act as a key technical contact for assigned customers and projects.
* Provide feedback to engineering teams to support continuous product improvement.


Technologies You Will Work With

* Direct-to-chip liquid cooling
* Rear-door heat exchangers
* Single-phase and two-phase liquid cooling systems
* Coolant distribution units (CDUs)
* Pumps, cold plates, manifolds, hoses, and fluid management systems
* High-density racks supporting AI and HPC workloads


Candidate Profile


Essential

* Degree in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or similar.
* 3–7 years’ experience in a Field Applications Engineer, Systems Engineer, or technical support role.
* Experience with data centre infrastructure, cooling systems, or related mechanical/thermal technologies.
* Strong understanding of heat transfer, fluid dynamics, and thermal management principles.
* Ability to interpret engineering drawings, P&IDs, and technical specifications.
* Excellent communication skills and confidence working directly with customers.

Desirable

* Experience with liquid cooling technologies such as direct-to-chip, immersion, or rear-door cooling.
* Familiarity with thermal modelling or simulation tools.
* Experience working with hyperscale or colocation data centre operators.
* Knowledge of EU safety or environmental standards.
* Additional European languages.


What’s on Offer

* Opportunity to work in a fast-growing sector driven by AI and cloud infrastructure expansion.
* Exposure to cutting-edge data centre cooling technologies.
* A customer-facing engineering role with real influence on project success.
* Collaboration with international engineering and commercial teams.
* Regular engagement with major data centre operators and technology partners.


This role does not offer sponsorship.

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