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Role Purpose
Product Engineering Manager to lead a wafer fab-embedded team responsible for sustaining engineering, yield improvement and manufacturability of Indium Phosphide (InP) chip products.
1. As Product Engineering Manager you will own end-to-end yield, product performance, and manufacturability across new and mature Indium Phosphide (InP) products within the wafer fab and downstream manufacturing flow.
2. Lead the site Yield Program with accountability to drive yield in excess of planning targets for all mature products, achieve cycle time, and reduce wafer scrap in line with AOP commitments.
3. Provide technical and organizational leadership across Process Integration, NPI, Yield, Test, and Product Engineering to ensure predictable, high-quality, and cost-effective manufacturing outcomes. Embed a culture of ownership, execution, and data-driven decision making where engineers actively drive yield and product health rather than react to issues.
Scope & Impact
4. Lead and manage Product Engineering, Process Integration, Yield and Test activities embedded in fab operations.
5. Act as the single point of accountability for fab yield performance, product health and manufacturability across multiple InP product lines.
6. Own yield strategy, governance and execution from new product introduction through to high-volume production.
7. Drives cross-functional alignment across R&D, Process Engineering, Equipment Engineering, Epitaxy, Manufacturing Operations, Quality, and downstream manufacturing.
Key Responsibilities
8. Yield Program Ownership: Accountable for exceeding planned end-to-end yield targets on all mature products, establishing contingency plans for yield variability and delivering wafer scrap reduction aligned to AOP cost targets.
9. Fab Product Ownership: Own day-to-day product performance in the wafer fab including yield, electrical and optical parametric performance, defectivity and cycle time.
10. NPI Excellence: Lead all NPI transfers and ramps with first-pass yield success as a core requirement; ensure DFM, PFMEA, control plans and readiness reviews are completed prior to volume release.
11. Yield Engineering & Continuous Improvement: Establish and execute structured yield improvement frameworks using Pareto analysis, FMEA, DOE, SPC, and 8D methodologies with clear owners and closure.
12. SPC, Data & Early Detection: Build and sustain live yield and product dashboards; strengthen SPC on both process parameters and product parametrics; integrate inline metrology for early defect detection.
13. Test Engineering & Cycle Time Recovery: Provide input into Test Engineering activities to maximize uptime, standardize work, monitor capacity, and restore test-driven cycle time losses.
14. Manufacturability & Cost: Drive process robustness, simplification, and cost-of-yield improvements through close partnership with process integration, equipment, and epitaxy teams.
15. Cross-Functional Leadership: Chair site-level yield reviews and MRB; lead excursion response and root cause investigations with disciplined containment and corrective actions.
16. Internal Customer Support: Serve as the primary product engineering interface to internal customers, providing clear communication of product status, risks, and mitigation plans.
Leadership Expectations
17. Align resources to current business priorities and yield risks; eliminate misalignment and low-value work.
18. Set clear goals, metrics, and accountability for individual contributors.
19. Drive a strong fab presence for yield and product engineers, balancing fab and desk time based on business need.
20. Develop skills matrices, succession plans, and targeted technical training in SPC, DOE, FMEA, and root cause analysis.
21. Promote transparency, engagement, and ownership through clear communication of goals, progress, and results.
Required Qualifications
22. Bachelor’s degree in electrical engineering, Materials Science, Physics, Data Science, or related technical field.
23. 10+ years of semiconductor manufacturing, product, or sustaining engineering experience, Experience with III-V technologies (InP preferred); strong silicon semiconductor manufacturing experience will also be considered.
24. 5+ years of technical leadership and people management experience in a wafer fab or manufacturing environment.
25. Strong hands-on expertise in yield analysis, SPC, DOE, FMEA, and structured problem-solving methodologies.
26. Demonstrated ownership of fab yield, product performance, and cross-functional improvement programs.
Preferred Qualifications
27. Master’s or PhD in a relevant technical discipline.
28. Direct experience with InP devices preferred such as lasers, modulators, photodiodes, and their manufacturing challenges.
29. Working knowledge of epitaxy, lithography, etch, metallization, deposition, and test for III-V semiconductors.
30. Proven experience leading NPI transitions from R&D into high-volume manufacturing.
Success Metrics
31. Sustained yield improvement exceeding targets on all mature products.
32. Measured wafer scrap reduction aligned to AOP cost and savings targets. Recovery and stabilization of test-driven cycle time.
33. Visible, actionable yield and product dashboards used across the site.
34. Improved engagement, accountability, and execution within NPI, Yield, and Product Engineering teams.