We are exclusively representing a high‑profile leader in power electronics manufacturing that is expanding its engineering team by seeking a senior packaging design engineer.
The company produces a range of devices that are multi‑application focused, involving GaN and SiC integration.
Responsibilities
* Design and development of power module packaging for wide band gap semiconductor devices.
* Focus on low losses (electrical and thermal) and high reliability.
* Embed power devices within multi‑layered laminated material stacks to produce power modules with both high power density and low losses.
* Develop module designs with system‑level architecture in mind.
* Consider capacitor integration, heat‑sink design/coolant flow integration, placement of gate drive boards and power busbars, etc.
Required Experience
* Embedded packaging experience.
* Prior power module design experience is a key advantage.
* Module packaging and integration of SiC or GaN.
* Experience in predicting the right materials being used.
* 2D + 3D modeling experience.
* PCB design software experience.
* Simulation experience is essential; ideally using Ansys.
Seniority Level
Mid‑Senior level
Employment Type
Full‑time
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