Senior Packaging Engineer // Remote // UK
The Oho Group have partnered with a growing semiconductor company looking for a senior NPI Packaging Engineer to join their team. This is an end-to-end role spanning design, analysis and client-facing work, offering opportunities to liaise with a variety of clients across Europe
What you'll need
* Strong communication skills and the ability to form relationships with a vast array of clients across Europe
* In-depth understanding of packaging, including industry knowledge and the manufacturing process
* Familiarity with package types such as DFN, QFN, BGA, SiP, and WLCSP.
* Experience using 3D CAD design tools such as AutoCAD or similar.
* Good understanding of semiconductor package thermal analysis and characterization.
* Experience from RF, memory or microprocessor environments
If you're interested in taking real ownership over packaging solutions for an exciting company in a growing market, all fully remote, please reach out!