Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance.
Interested in this role You can find all the relevant information in the description below.
Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include: Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies Knowledge of die bonding methods for good thermal and mechanical performance Experience working with 3rd party suppliers Strong internal and external communication skills Degree qualified Please contact Rachel Anderson for further details.