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Memory team - physical design engineer

Market Drayton
SAMSUNG
Design engineer
Posted: 1 July
Offer description

Position Summary

Complex SOC Top Physical Implementation for next generation SoCs through synthesis, place and route, STA, timing, and physical sign-offs.

Role and Responsibilities

* Hands-on experience in physical design and timing closure of complex blocks and full-chip designs.
* Strong understanding of timing, power, and area trade-offs, with a focus on PPA optimization.
* Proficiency with industry-standard tools (ICC, DC, PT, VSLP, Redhawk, Calibre, Formality) and understanding their capabilities.
* Solid understanding of scripting languages such as Perl and Tcl, and implementation flows.
* Experience with large SoC designs (>20M gates) operating at frequencies above 1GHz.
* Expertise in block-level and full-chip SDC cleanup, synthesis optimization, low power checking, and logic equivalence checking.
* Familiarity with deep sub-micron designs (8nm/5nm) and related issues like manufacturability, power, signal integrity, and scaling.
* Knowledge of typical SoC issues such as multiple voltage and clock domains, ESD strategies, mixed-signal block integration, and package interactions.
* Experience with hierarchical and top-down design, budgeting, timing, and physical convergence.

Skills and Qualifications

* Experience in top-level floorplanning, including partition shaping, pin placement, channel planning, high-speed signal and clock planning, and feed-through planning.
* Understanding of Physical Design Verification methodologies to debug LVS/DRC issues at chip/block level.
* Participation in at least 4 recent successful SoC tape-outs.
* 8 to 14 years of experience in physical implementation and design.

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