My client is seeking a Principal Packaging Engineer to lead the design and development of cutting-edge advanced packaging technologies.
What you’ll do:
* Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype
* Oversee design, assembly, testing, and validation of advanced packaging demonstrators
* Define technology roadmaps and guide multiple packaging projects.
* Collaborate with internal and external teams to solve system-level integration challenges
* Represent the company in technical forums, proposals, and collaborative bids
About you:
* Proven experience in advanced semiconductor packaging - 3D/2.5D
* Strong, extended knowledge of design, modelling, assembly, and validation processes
* Skilled in signal/power integrity and thermal management
* Excellent communication, leadership, and problem-solving skills
* Track record of delivering demonstrators and leading cross-functional teams
Benefits include:
* 15% pension (10% employer)
* Annual bonus
* Private medical insurance extended to family
* Visa sponsorship and financial relocation assistance
If you're looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources