Company Description
Do you relish the challenge of being part of a growing business, a team, an industry, and seeing the energy you help generate? Are you at your best when contributing to a range of projects and collaborating across teams to help inform, direct and support those around you in solving the problems of the future?
Within CSA Catapult, we look beyond the status quo. We seek to employ people based on ability and attitude; we measure what you deliver and how you do it. We encourage collaboration in everything we do as we value the diversity of thought that we each bring to every challenge.
Who are we? The next wave of emerging technologies will have an enormous impact on our lives. 5G communications will enable a host of new and exciting applications such as connected autonomous vehicles and multimedia services. The challenge of net‑zero to have clean, renewable energy and move from the internal combustion engine to electric cars. Compound semiconductor (CS) technologies will underpin many of these developments.
We are a Not‑for‑Profit organisation; here to help the UK economy grow, and we work across the UK with a range of industry sectors from automotive to medical, and from digital communications to aerospace. Through employing leading minds and investing in technology, we help turn ideas into reality, bridging the gap between concept and implementation.
CSA Catapult is committed to supporting and upholding diversity, equality, and inclusion in everything we do. A commitment to embrace and advocate for inclusion is an essential part of all roles.
Position
Reporting to the Engineering Manager (Advanced Packaging), the Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next‑generation systems more energy and packaging efficient.
The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor‑based devices, modules and systems.
They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials. Key responsibilities include:
* Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi‑die or system in package (SIP) packaging solutions for power electronics/ RF/ Photonics
* Provide package design inputs, material selection and assembly process development for a number of different semiconductor packages
* Follow the semiconductor/ micro‑electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip‑Chip, hybrid bonding, Wire bond, SIP (System in Package)
* R&D of assembly interconnects and interfaces
* Semiconductor package prototyping, testing, reliability & failure analysis
* Develop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issues
* Work with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologies
* Actively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methods
* Study microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packaging
* Gather customer requirements and follow procedures to build assembly process relevant to the project work.
* Conduct experiments to determine material properties and relate these to project work
* Use results from simulations and experiments to aid package design
* Operate key assembly equipment and undertake process and SOP development
* Generate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specifications
* Estimate set‑up times, flow‑times, costs of production and acceptance equipment
* As needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectives
* Work closely with suppliers providing technical specifications and procuring components and test equipment to specification and budget
* Participate in technical risk assessments
Requirements
The Process Engineer is expected to have strong knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology. Prior relevant experience, particularly hands‑on wire bonding experience is essential for this role.
They will exemplify the behaviours and values of the Catapult of collaboration, innovation, and trust.
You will have:
* Ideally a Degree in Engineering/ Science (Mech, Materials, Electrical, Physics) discipline with 2 years of relevant industry experience; or sufficient relevant experience in a directly applicable role
* Demonstrable microelectronics packaging experience that includes practical assembly, wire/ die bonding and validation
* Previous hands‑on experience with gold and aluminium wire bonding (essential)
* Experience with setting up and programming Thermosonic for Gold and Ultrasonic for Aluminium machine set up
* Experience operating and setting up wire bonding equipment (manual, semi‑automatic)
* Experience performing quality inspections, such as mechanical pull/shear tests and microscopic visual inspection
* Experience troubleshooting common bonding defects and implementing corrective actions
* Proof of concept or prototype development
* Excellent verbal and written communication skills in English
* Excellent team working skills with the proven ability to work collaboratively and cooperatively with colleagues
* Analytical and problem‑solving skills, including the ability to quickly understand complex issues and propose solutions
* A system engineering approach to projects
* Familiar with engineering lifecycle management
* 8D problem‑solving
* History of translating research output into working prototypes
* Proficient in Microsoft Office products
* Skills in data analytics, familiar with Matlab, Python and other programming skills
Other information
* Up to £52,767 salary (FTE)
* A non‑contractual bonus scheme to allow everyone to share in our success
* Life Assurance – 4 times your annual salary
* Scottish Widows pension scheme – you put in 5% and we’ll put in 10%
* 28 days leave in addition to 8 bank holidays
* 37.5 hour full time working week
* A generous private medical insurance scheme for you and your family (enrolment once a year)
* A cashback scheme for your eye tests and dental treatment
* Payment for a professional membership each year
* Holiday purchase scheme (enrolment once a year)
* Flexible working – we operate core hours of 10-4. The balance of your hours can be worked around what works for you
* Electric Vehicle and Cycle to work schemes
Seniority level
* Mid‑Senior level
Employment type
* Full‑time
Job function
* Engineering, Design, and Research
Industries
* Semiconductor Manufacturing, Computers and Electronics Manufacturing, and Research Services
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