Company Description Do you relish the challenge of being part of a growing business, a team, an industry, and seeing the energy you help generate? Are you at your best when contributing to a range of projects and collaborating across teams to help inform, direct and support those around you in solving the problems of the future? Within CSA Catapult, we look beyond the status quo. We seek to employ people based on ability and attitude; we measure what you deliver and how you do it. We encourage collaboration in everything we do as we value the diversity of thought that we each bring to every challenge. Who are we? The next wave of emerging technologies will have an enormous impact on our lives. 5G communications will enable a host of new and exciting applications such as connected autonomous vehicles and multimedia services. The challenge of net-zero to have clean, renewable energy and move from the internal combustion engine to electric cars. Compound semiconductor (CS) technologies will underpin many of these developments. We are a Not-for-Profit organisation; here to help the UK economy grow, and we work across the UK with a range of industry sectors from automotive to medical, and from digital communications to aerospace. Through employing leading minds and investing in technology, we help turn ideas into reality, bridging the gap between concept and implementation. CSA Catapult is committed to supporting and upholding diversity, equality, and inclusion in everything we do. A commitment to embrace and advocate for inclusion is an essential part of all roles. Position CSA Catapult is seeking a Graduate Advanced Packaging Engineer to join our dynamic team, contributing to innovative research and development activities aimed at integrating AI-driven optimisation with digital twin platforms for electronic package design. This exciting role involves developing intelligent models for process control, working with simulation tools, and collaborating with both academic and industry partners. The Graduate Engineer will support an important CSAC project by undertaking research and development activities focused on integrating AI-driven optimisation with digital twin platforms for electronic package design. The role will involve developing intelligent models for process control, working with simulation tools, and collaborating with academic and industry partners. The Graduate Engineer will report to and support the project lead and will exemplify the behaviours and values of the Catapult of collaboration, innovation, and trust. The Graduate Engineer will: Assist in developing AI-driven models to optimise manufacturing process parameters, focusing on precision and sustainability Support the integration of AI tools with simulation platforms (e.g., MATLAB, Python, Ansys Electronics Desktop) for digital twin development Feed data into AI algorithms for process optimization as part of the overall project workflow Collaborate with academic and industrial partners to facilitate knowledge transfer and validate results Participate in preparing technical reports, publications, and presentations for internal and external stakeholders Support project dissemination through conferences, workshops, and consortium meetings Ensure projects meet technical deliverables and milestones according to scope, budget, and time Maintain accuracy in data handling and process optimisation modelling Adhere to best practices in technical reporting and presentation Requirements Ideally a Degree in a relevant engineering/ science discipline (Electrical Engineering, Computer Science, Physics or a related field) with relevant experience in AI-driven optimisation and digital twin development Proficiency in simulation software (MATLAB, Python, Ansys Electronics Desktop) and data analysis tools Strong analytical and problem-solving skills with a keen interest in AI and digital twin technologies Demonstrated ability to work both independently and collaboratively in multidisciplinary teams Excellent written and verbal communication skills, including technical reporting and presentation Excellent team working skills with the proven ability to work collaboratively, effectively and cooperatively with colleagues Good analytical and problem-solving skills like attention to detail, critical thinking and ability to solve problems Desirable Experience: Experience with AI-driven process optimisation or digital twin development Familiarity with semiconductor packaging technologies and advanced characterisation technique Excellent verbal and written communication and presentation skills Other information We offer: Up to £34,000 per annum (full time annual salary) A non-contractual bonus scheme to allow everyone to share in our success Life Assurance – 4 times your annual salary Scottish Widows pension scheme – you put in 5% and we’ll put in 10% 28 days leave in addition to 8 bank holidays 37.5 hour full time working week A generous private medical insurance scheme for you and your family (enrolment once a year) A cashback scheme for your eye tests and dental treatment Payment for a professional membership each year Holiday purchase scheme (enrolment once a year) Flexible working – we operate core hours of 10-4. The balance of your hours can be worked around what works for you Electric Vehicle and Cycle to work schemes