A leading technology company in Edinburgh is seeking a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies. The ideal candidate will have strong experience in semiconductor package design and a proven track record in microelectronics packaging projects. Responsibilities include architecting innovative solutions, leading R&D programmes, and representing the company in industry discussions. Competitive salary and benefits including relocation support. #J-18808-Ljbffr