Overview This position is for Principal Process Integration engineer supporting 200 and 300mm wafer fabs. The candidate will be responsible for driving continuous improvement in product and ET/PCM yield, and supporting new process development/introduction, and design rule and test structure development for new technologies. Key tasks Responsible for developing/qualifying technology process flows and process integrations to enable meeting the product requirements for performance, reliability, and defect free manufacturing. Ensure methods and processes in place to test the devices and structures being developed. Support new designs with module characterization and design rule development. Develop and improve yield characterization and data analysis methodologies to rapidly determine yield limiters, correlation to in-line defectivity and metrology, and electrical parametric signals. Liaise with Quality Engineers to resolve customers’ technical & yield concerns and meet the requirements. Run Design of experiments to optimize process margins and determine process & Electrical test specifications. Experience of leading engineer team, developing and delivering technology for mass production. Lead Process FMEA and Transfer FMEA. Collaborate with PDK and Design Teams on Design rule check/ Design for manufacturing and define/document the design rules for the technologies. Qualifications and training Bachelor’s Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering Skills and experience Experience in high volume semiconductor manufacturing (200mm/ 300mm), with significant process integration or process development experience. Strong planning & organizational skills. Organized and systematic in problem solving, familiar with SPC, DOE & FMEA Strong communication, presentation, and interpersonal skills