Overview
* This position is for Principal Process Integration engineer supporting 200 and 300mm wafer fabs.
* The candidate will be responsible for driving continuous improvement in product and ET/PCM yield, and supporting new process development/introduction, and design rule and test structure development for new technologies.
Key tasks
* Responsible for developing/qualifying technology process flows and process integrations to enable meeting the product requirements for performance, reliability, and defect free manufacturing.
* Ensure methods and processes in place to test the devices and structures being developed.
* Support new designs with module characterization and design rule development.
* Develop and improve yield characterization and data analysis methodologies to rapidly determine yield limiters, correlation to in-line defectivity and metrology, and electrical parametric signals.
* Liaise with Quality Engineers to resolve customers' technical & yield concerns and meet the requirements.
* Run Design of experiments to optimize process margins and determine process & Electrical test specifications.
* Experience of leading engineer team, developing and delivering technology for mass production.
* Lead Process FMEA and Transfer FMEA.
* Collaborate with PDK and Design Teams on Design rule check/ Design for manufacturing and define/document the design rules for the technologies.
Qualifications and training
* Bachelor's Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
Skills and experience
* Experience in high volume semiconductor manufacturing (200mm/ 300mm), with significant process integration or process development experience.
* Strong planning & organizational skills.
* Organized and systematic in problem solving, familiar with SPC, DOE & FMEA
* Strong communication, presentation, and interpersonal skills