Job summary
Our client, a leader in the Defence & Security sector, is seeking a Senior Mechanical Engineer to support with Thermal Analysis.
Key skills required for this role
Thermal, IcePak, CREO, Ansys
Important
Senior Mechanical Engineer - Thermal Analysis
Job description
Location: Basildon (1 day per week onsite)
Duration: 6 month contract
Rate: £55.05ph UMB (Inside IR35)
Role details:
Our client, a leader in the Defence & Security sector, is seeking a Senior Mechanical Engineer to support on a contract basis. This role requires on-site presence one day per week and is focused on the integration and thermal analysis of Electro-Mechanical Products.
Key Responsibilities:
1. Analyse and assess Electro-Mechanical Products for thermal performance against Systems Requirements using finite element techniques and classical hand calculations.
2. Generate Finite Element Models and reports as per industry requirements.
3. Support the selection of compliant solutions, including materials, based on recognised Thermal Management solutions.
4. Conduct thermal analyses of complex products using Ansys IcePak.
5. Advise and support on the development of mechanical thermal management solutions to meet product requirements.
6. Generate mechanical solutions for harsh environments (Shock, Vibration, Temperature, EMC, etc.).
7. Design of engineering solutions considering all requirements including product quality, safety, reliability, testability, and sustainability.
8. Produce Manufacturing Data Packs in line with BS8888 and generate BoM within the approved PLM system (Teamcenter).
What we are looking for in you:
9. Proven experience in the use of Finite Element Analysis software tools (preferably Ansys IcePak) and techniques.
10. Hands-on mechanical design and development using 3D CAD software (PTC Creo).
11. Application of a wide range of classical hand calculation techniques for Thermal Analyses.
12. Experience in the integration of Printed Circuit Boards within a mechanical structure, with knowledge of electrical screening, grounding, etc.
13. Experience in the thermal analysis of Printed Circuit Boards, with comprehensive knowledge of thermal management techniques.
14. Experience in various aspects of DfX, including Manufacturing, Assembly, Test, Integration, and Sustainability.
15. Detail and assembly drawing generation in accordance with BS8888, including numerical calculations and tolerance studies.
Desirable:
16. Experience in Thermal Analysis using Siemens NX.
17. Experience of practical test methods for design verification related to Thermal requirements.
18. Share
manages this role
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