My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies. What you’ll do: Architect innovative 2.5D/3D packaging solutions from concept to prototype. Lead advanced packaging R&D programmes and technology roadmaps. Oversee design, assembly, test, and validation of complex semiconductor packages. Collaborate across teams to solve system-level packaging challenges. Represent the company in technical discussions, bids, and industry forums. What we’re looking for: Strong experience in semiconductor package design and development (3D/2.5D) Proven track record leading microelectronics packaging projects. Deep understanding of design, modelling, and validation processes. Excellent communication, leadership, and problem-solving skills. Benefits: Competitive salary 15% pension (10% employer) Annual bonus Private medical cover extended to family Sponsorship with up to £5000 in relocation fees If you're looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources.