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Senior ic packaging engineer- silicon

Oxford
Wave Recruitment
Packaging engineer
Posted: 16h ago
Offer description

Photonics IC Packaging Engineer – Photonics & Semiconductors

Oxford, UK (Hybrid)

Permanent | Full-time



Find out more about this role by reading the information below, then apply to be considered.

Wave Recruitment is hiring a Photonics IC Packaging Engineer for a breakthrough deep-tech company building the hardware that will power next-generation AI and data centre infrastructure.


This isn’t just another packaging role. You’ll be a key contributor in a small team (currently two people in packaging), developing and delivering the electrical packaging solutions that take photonic-electronic modules from R&D through to high-volume production.


Your work will directly impact how AI workloads are scaled worldwide, solving performance and reliability bottlenecks that currently hold back large-scale compute. The role also includes occasional overseas travel to work with international suppliers and manufacturing partners.


What You’ll Be Doing


* Designing packaging solutions for photonic-electronic systems, from substrates to interposers
* Owning deliverables end-to-end: design, supplier engagement, documentation, and verification
* Defining and running test plans for thermal, mechanical, and reliability performance
* Troubleshooting packaging challenges and driving yield improvements at scale
* Working closely with hardware, optical, and manufacturing partners to ensure manufacturability and cost efficiency
* Collaborating with overseas suppliers and supporting on-site activities as required


What You’ll Bring


* Strong background in semiconductor packaging (substrates, interposers, high bump-count devices)
* Experience taking packaging from concept through to production
* Knowledge of thermal management, warpage, mechanical stress, and yield optimisation
* Hands-on approach in lab/prototype environments, alongside supplier-facing delivery
* Excellent communication skills across internal teams and external partners
* Willingness to travel internationally when required


Why This Role?


* Impact: Shape packaging for the technologies driving the next wave of AI
* Ownership: Responsibility for packaging deliverables in a small, high-impact team
* Innovation: Work at the frontier of photonics and semiconductors, not incremental upgrades


Interested? Apply directly or contact Wave Recruitment for more details.


#semiconductors #photonics #packaging #electronics #AI #hardware #engineeringjobs

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