Our leading-edge Oxford-based client is currently seeking an experienced Packaging Engineer to lead the packaging roadmap. The role involves collaborating with internal and external providers to develop and produce quantum processor devices.
Key responsibilities include:
* Developing wirebond and bumping methods
* Developing photonics packaging methods across various frequencies
* Creating packaging solutions with optimal thermal performance
* Designing and supervising failure analysis experiments
Required skills for the Packaging Engineer include:
* Experience with semiconductor/photonic packaging techniques and knowledge of package substrate technologies
* Understanding of die bonding methods for thermal and mechanical efficiency
* Experience collaborating with third-party suppliers
* Strong communication skills
For further details, please contact Rachel Anderson.
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