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Rf packaging process engineer - die attach & wire bonding

Sedgefield
Filtronic Plc
Process engineer
€40,000 a year
Posted: 10h ago
Offer description

Filtronic Plc seeks a Process Engineer to enhance its production processes at their Sedgefield facility. The role involves developing and optimizing semiconductor assembly processes, particularly die attach methods and gold wire bonding. Candidates should possess a degree in Engineering or related fields, have experience in assembly processes, and demonstrate strong analytical and problem-solving skills. Filtronic is committed to diversity and encourages applications from all qualified candidates.
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