About Our Client
Our client is a newly established Outsourced Semiconductor Assembly and Test (OSAT) organisation, created to deliver high‑quality, cost‑effective, and scalable packaging and testing solutions to global semiconductor customers. The business is backed by leading global technology enterprises and is positioned to serve fast‑growing markets including display, sensor, memory, IoT, industrial, and automotive semiconductors.
Job Description
* Lead planning and execution of a new OSAT facility build, reporting directly to the CEO.
* Establish and industrialise advanced packaging and test technologies including WLP, CP, and DPS.
* Define and execute the technology roadmap across advanced packaging and test solutions.
* Drive R&D initiatives to improve yield, performance, reliability, and cost efficiency.
* Collaborate closely with customers, suppliers, and internal leaders to deliver customised OSAT solutions.
The Successful Applicant
* 15+ years' experience in semiconductor packaging, assembly, and test within OSAT or IDM environments.
* Proven executive‑level leadership in technology strategy, R&D, and high‑volume manufacturing.
* Deep expertise in RDL, bumping, wafer‑level packaging, and semiconductor test methodologies.
* Hands‑on experience with new fab planning, tool installation, and technology transfer.
* Strong commercial mindset with experience in customer engagement and technology partnerships.