Senior Packaging Process Engineer
Newport, Wales, United Kingdom
Company Description
Do you relish the challenge of being part of a growing business, a team, an industry, and seeing the energy you help generate? Are you at your best when contributing to a range of projects and collaborating across teams to help inform, direct and support those around you in solving the problems of the future?
Within CSA Catapult we look beyond the status quo. We seek to employ people based on ability and attitude; we measure what you deliver and how you do it. Collaboration and diversity of thought are core to everything we do. CSA Catapult is committed to supporting and upholding diversity, equality and inclusion in every role.
We are a Not‑For‑Profit organisation that helps the UK economy grow. We work across the UK in industries from automotive to medical, digital communications to aerospace, turning ideas into reality by combining leading talent and cutting‑edge technology.
Position
CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment, exploring and developing disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high‑speed interconnects and advanced semiconductor packaging. This role is pivotal in delivering cutting‑edge packaging solutions for next‑generation systems in AI, co‑packaged RF and photonics.
Key Responsibilities
* Lead development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high‑density interposers and high‑speed interconnect solutions.
* Design and validate high‑speed interconnect solutions as part of heterogeneous integration and SiP platforms.
* Define and validate interconnect schemes (fine‑pitch flip chip, wafer‑level packaging, hybrid bonding) to meet electrical, thermal and mechanical performance targets.
* Develop robust assembly process flows, including die attach, underfill, bonding and encapsulation for 3D stacked and interposer‑based packages.
* Lead design‑for‑manufacturability activities in collaboration with internal and external design and product development teams.
* Drive technical DOEs, reliability testing, failure analysis and statistical process control for advanced packaging.
* Interface with technology partners, equipment vendors and customers to evaluate and implement state‑of‑the‑art materials and tools.
* Lead lab‑based activities including equipment setup, process characterization, prototyping and DOEs using die bonders, sinter presses, wire bonders and plasma cleaners.
* Lead project teams and contribute to bid proposals, technical plans and funding applications.
* Act as a technical authority across multiple packaging projects, mentoring junior engineers and collaborating with cross‑functional teams.
* Prepare technical documentation – work instructions, process flow diagrams and qualification reports.
* Interface with commercial, R&D and customer teams to ensure alignment of assembly processes with program goals.
* Contribute to scale‑up plans and future‑proofing strategies for process industrialisation and facility readiness.
* Contribute to the strategic roadmap for CSA Catapult’s advanced packaging capability.
* Present results and work to wide audiences to enhance the Catapult’s reputation.
Requirements
* Deep expertise in advanced microelectronics assembly process, with hands‑on experience in 2.5D /3D integration, hybrid bonding, flip chip and SiP.
* Strong background in semiconductor packaging processes such as die stacking, hybrid bonding, TSV, RDL and wafer‑level packaging.
* Proven track record of leading packaging R&D projects, including prototype development and validation of high‑speed digital and analogue hardware.
* Knowledge of electrical and thermal modelling, material behaviour at high frequency and system‑level integration.
* Familiarity with cleanroom protocols, lab tools and statistical process control (SPC) methodologies.
* Experience supporting equipment procurement, installation and process development in an R&D or pilot line environment.
* Excellent verbal and written communication skills in English.
* Excellent team working skills with the proven ability to collaborate and cooperate with colleagues.
* Analytical and problem‑solving skills, including the ability to understand complex issues quickly and propose solutions.
Benefits and Compensation
* Up to £63,960 salary (FTE)
* A non‑contractual bonus scheme allowing everyone to share in our success.
* Life Assurance – 4 times your annual salary.
* Scottish Widows pension scheme – you contribute 5% and we contribute 10%.
* 28 days leave in addition to 8 bank holidays.
* 37.5 hour full‑time working week.
* A generous private medical insurance scheme for you and your family (enrolment once a year).
* A cashback scheme for eye tests and dental treatment.
* Payment for a professional membership each year.
* Holiday purchase scheme (enrolment once a year).
* Flexible working – core hours 10–4; remaining hours can be worked around your needs.
* Electric Vehicle and Cycle‑to‑work schemes.
Seniority Level
Mid‑Senior level
Employment Type
Full‑time
Job Function
Engineering, Research and Design
Industries
Computers and Electronics Manufacturing, Semiconductor Manufacturing, and Research Services
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