My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies.
What you’ll do:
* Architect innovative 2.5D/3D packaging solutions from concept to prototype.
* Lead advanced packaging R&D programmes and technology roadmaps.
* Oversee design, assembly, test, and validation of complex semiconductor packages.
* Collaborate across teams to solve system-level packaging challenges.
* Represent the company in technical discussions, bids, and industry forums.
What we’re looking for:
* Strong experience in semiconductor package design and development (3D/2.5D)
* Proven track record leading microelectronics packaging projects.
* Deep understanding of design, modelling, and validation processes.
* Excellent communication, leadership, and problem-solving skills.
Benefits:
* Competitive salary - mid £70k
* 15% pension (10% employer)
* Annual bonus
* Private medical cover extended to family
* Sponsorship with up to £5000 in relocation fees
If you're looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources.