About Us
Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front‑end architectures for mobile and connected devices. Our long‑term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers' toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design.
Location
Cambridge, UK
Team
New Product Introduction
Job Type
Full‑Time, Permanent
Our Values
* One team: We listen, share, and build solutions together. Collaboration is at the heart of how we work. We support one another, embrace challenges and fun, and celebrate collective success.
* Innovation with intent: We operate at the forefront of technology, building innovative pathways to the future that meets real customer needs.
* Solutions driven: We develop world leading manufacturable products that deliver effortless connectivity.
* Customer focused: We act with integrity, hold ourselves accountable, and are guided by a deep commitment to deliver customer focused solutions.
* Sustainable: We design for longevity and reuse - leveraging globally connected RF technology to extend product lifecycles and reduce waste.
Role Overview
We're looking for an Assembly Engineer to help drive the assembly and packaging activities behind our RF semiconductor products as we continue to scale the business. This is a newly created role and an exciting opportunity to shape how we develop and transition products from prototype through to volume production.
You’ll work closely with design, test, operations, suppliers, and manufacturing partners in an hands‑on engineering environment, helping deliver robust, scalable, and high‑quality packaging solutions for next‑generation products.
Key Responsibilities
* Manage semiconductor assembly activities across prototype and production builds.
* Work with OSAT and manufacturing partners on package assembly and process development.
* Support new product introduction (NPI) and manufacturing readiness activities.
* Drive yield improvement and root‑cause analysis for assembly‑related issues.
* Coordinate reliability testing, qualification, and failure analysis activities.
* Collaborate with design, test, and product engineering teams to optimise manufacturability.
* Create and maintain assembly documentation, process flows, and manufacturing specifications.
* Identify continuous improvement opportunities across quality, cost, and production efficiency.
Requirements
* Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar.
* Experience in semiconductor assembly, packaging, or manufacturing engineering.
* Understanding of semiconductor packaging and assembly processes.
* Familiarity with OSATs and outsourced semiconductor manufacturing.
* Experience with yield improvement, failure analysis, and process optimisation.
Desirable
* Experience with RF or mixed‑signal semiconductor products.
* Knowledge of reliability and qualification processes.
* Familiarity with manufacturing data analysis and process control.
* Understanding of advanced semiconductor packaging technologies.
* Experience supporting consumer, IoT, or automotive semiconductor products.
People Skills
* Proactive approach to problem‑solving with a resilient attitude towards ambiguity.
* Excellent problem‑solving and analytical skills.
* Strong communication and collaboration abilities.
* Ability to work independently and as part of a team.
* Attention to detail and commitment to producing high‑quality output.
Benefits
* Competitive salary and pension contributions.
* Company Share Option Scheme.
* 25 days holiday + bank holidays.
* Weekly company lunches.
* Flexible work hours and remote work options.
* Private medical insurance.
* Life assurance x 4.
* Income protection.
* Healthshield Cash plan.
* Heka flexible benefits platform.
Equal opportunities
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, colour, sex, gender identity, sexual orientation, age, non‑disqualifying physical or mental disability, national origin, veteran status, or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
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