A technology recruitment firm in the UK is seeking a Principal Semiconductor Packaging Engineer to lead the development of next-generation packaging technologies. The ideal candidate will architect innovative solutions, oversee advanced R&D programmes, and collaborate with teams to tackle challenges in semiconductor packaging. Strong experience in package design and development is required, along with excellent communication and leadership skills. This role offers a competitive salary and generous benefits, including a pension and relocation support. #J-18808-Ljbffr