Our Newport based client is currently searching for a Senior Packaging Process Engineer to work within a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies. The role will involve leading a team of engineers to develop new microelectronic devices with novel new packaging concepts including assembly, wire‑bonding and die bonding. Prototype development will be an important part of the role.
Required skills for the Senior Packaging Process Engineer will include :
* Strong semiconductor packaging and assembly experience
* Semiconductor device knowledge
* Strong communication and leadership skills
* Degree qualified in Physics, Electronics, Engineering or equivalent
Please contact Rachel Anderson for further details.
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