Purpose of the Job
* To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.
Key Job Accountabilities:
* Develop and optimize electroplating, seed etching, and PR stripping processes
* Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation
* Evaluate and introduce new materials and equipment for plating/etching process integration
* Conduct pre-production process validation and yield stabilization
* Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)
* Develop customized processes and provide technical support for customer programs
* Set up equipment and optimize operating conditions in coordination with vendors
* Troubleshoot quality issues across plating and etching processes
* Support development of advanced packaging technologies including 2.5D, fan-out, and SiP
Required Experience and Qualifications:
* Bachelor’s degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials
* Minimum 3 years of hands‑on experience in plating, etching, or stripping processes in semiconductor manufacturing.
* Fundamental understanding of advanced semiconductor fabrication and integration processes
* Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting
* Proficiency in preparing technical documentation and delivering presentations
* Ability to communicate technical content clearly in English (written and verbal)
* Basic knowledge of semiconductor process equipment and materials
* Experience in key back‑end processes such as TSV, RDL, and micro bump
* Knowledge of advanced packaging technologies including 2.5D, fan‑out, and flip‑chip
* Familiarity with related processes such as photo, chip attach, and underfill
* Proven experience in joint development projects with global customers
* Hands‑on collaboration with material or equipment suppliers for co‑evaluation or integration
* Expertise in process reliability testing (e.g., thermal cycling, HAST)
* Experience in process automation or smart fab environments
* Working proficiency in tools such as AutoCAD or ANSYS
* In‑depth understanding of etch/strip conditions for back‑end photoresist materials
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