Packaging Engineer (GaN)
Team - R&D Engineering
Location - Cambridge, UK
Contract - Full-time, Permanent
About the Role
CGD is a fabless semiconductor company that develops energy‑efficient GaN‑based power devices. We are looking for a Packaging Engineer to join our growing engineering team. The role will support technical development of high‑performance and high‑density semiconductor packaging solutions for CGD’s GaN power products.
Main Responsibilities
* Work on the technical development of high performance and high‑density semiconductor packaging solutions for CGD GaN power products.
* Collaborate with internal stakeholders (GaN chip design team, Application Engineering team, Operations team) and external partners (packaging partners) in the UK and overseas.
* Survey the market for suitable packaging technologies to support CGD product roadmap.
* Support package technology developments with suppliers to differentiate CGD products.
* Conduct multiphysics simulations (finite element modelling) to analyse package and system level thermal performance, parasitic extraction, current spreading, electromagnetic fields and thermo‑mechanical stress of CGD’s GaN power packages.
* Assist with design of wirebond, flip chip and embedded semiconductor packages, including wafer back‑end process modifications, to meet product goals in terms of form factor and electrical/thermal performance.
* Contribute to development and enhancements of design process, tools and methodologies to streamline the design flow for first‑time right solutions.
* Support semiconductor packaging verification and qualification tests, including driving package‑related performance tests such as board‑level reliability, thermal characterisation, etc.
* Conduct first‑article inspection and failure analysis in the labs in Cambridge and with external partners.
* Provide packaging related resources to the Applications Engineering team and customers (package outline drawings, thermal models, PCB footprints, application notes and technical support).
Essential Requirements
* Bachelor’s degree or higher in Engineering, Physics, Materials Science or related subject.
* Experience with 3D multiphysics simulation (e.g. COMSOL, ANSYS or similar) for thermal, electrical and stress analysis using finite element modelling.
* Experience producing designs according to supplier design rules with a modern 3D CAD tool (e.g. SolidWorks, Fusion 360, AutoCAD).
* Solid understanding of thermal characterisation of semiconductor packages.
* Experience with semiconductor packaging qualification tests such as TCoB, MSL, TC, HAST and HTS according to JEDEC, IPC, MIL, AEC-Q100.
* Strong problem‑solving skills and use of appropriate methods such as 8‑D, DOE, Fishbone diagrams.
* Ability to manage own tasks and deliver results on time.
Desirable Requirements
* Experience designing and manufacturing high‑volume semiconductor packages with overseas assembly houses.
* In‑depth knowledge of power semiconductor packaging technologies (die‑attach, Ag‑sintering, flip‑chip, wire‑bonding, PCB embedding, chip metallisation).
* Track record designing and simulating semiconductor packages for voltages >100 V, ideally for GaN power devices.
* Experience with electromagnetic finite element modelling.
* Experience selecting and analysing test methods for semiconductor packaging (CSAM, X‑Ray, shear tests, CT, EDX, EMMI).
Benefits
* Excellent salary.
* Share options scheme.
* Pension scheme (6 percent company contribution).
* Life assurance (3 times salary).
* Medicash cash plan.
* Flexible working options (location and times).
* Annual leave allowance of 33 days (incl. bank holidays).
* Training and career development.
* Family‑friendly policies.
* Cycle‑to‑work scheme.
* EV leasing scheme.
* Volunteer leave policy.
* IP bonus scheme.
* Collaborative projects and grants with University of Cambridge.
* Recruitment referral bonus.
* Regular social events (company lunches, summer party, Christmas party, team building, wellbeing activities).
Equal Opportunities
We are committed to providing equal opportunities to all employees regardless of age, disability, sex, sexual orientation, pregnancy and maternity, race or ethnicity, religion or belief, gender identity, or marriage and civil partnership.
We believe in an inclusive workplace and place inclusion at the heart of all we do.
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