Hardware Platform Architect
Tessolve Cambridge, England, United Kingdom
About Us
Tessolve offers a unique combination of pre‑silicon and post‑silicon expertise to provide an efficient turnkey solution for silicon bring‑up and spec to product. With 3200+ employees worldwide, Tessolve delivers a one‑stop solution with advanced silicon and system testing labs.
We offer Turnkey ASIC Solutions from design to packaged parts, leveraging strong ecosystem partnerships with EDA, IP, and foundry vendors. Our integrated front‑end and back‑end expertise reduces design risks and accelerates time‑to‑market.
Our R&D centers of excellence focus on emerging technologies such as 5G, mmWave, Silicon Photonics, HSIO, HBM/HPI, and System‑Level Test. Tessolve also delivers end‑to‑end embedded product design services under an ODM model for Avionics, Automotive, Industrial, and Medical applications.
Tessolve’s clientele includes 9 of the top 10 semiconductor companies, along with Tier‑1 clients, start‑ups, and government entities. We have a global presence in 12+ countries, with advanced test labs in India, Singapore, Malaysia, Austin, and San Jose.
Role
Experienced (>10y) Hardware Platform Architect to support Arm’s Hardware Platform team. You will work with the SoC teams, architects and platform leads to help define, influence, align and agree technical requirements and features for implementation. Assess design trade‑offs to develop the most optimal solution for our customers and development partners.
Responsibilities
* Engage with technical leads, product managers and SoC development teams to translate technical requirements into platform architecture specifications addressing the embedded compute and infrastructure or server market segments
* Evaluate architecture proposals and features and coordinate across Silicon Architects, hardware, software and platforms to align all parties to a common vision
* Liaise with board hardware designers to drive specifications into implementation for schematic and PCB aligning with Packaging SI and PI Engineers.
* Communicate technical concepts clearly and credibly across audiences ranging from individual hardware and software engineers to architects and technology leads
Qualifications
* Deep technical background and solid understanding of SoC architectures, memory interfaces and platforms involving embedded compute, AI or related fields
* Experience with high‑speed interface standards (PCIe Gen5/6, LPDDR5/6) and peripherals for embedded compute
* Competence with embedded system board design, designing with complex LSI devices such as FPGAs and embedded firmware and power management ICs
* Experience of EDA tools for schematic entry, PCB layout from a board‑design perspective (Cadence OrCAD CIS, Allegro PCB suite)
* Strong knowledge of PCB stack‑up definition, controlled impedance routing guidelines for complex stack‑ups and topologies
* Excellent communication and interpersonal skills with the ability to coordinate and influence across multiple teams and geographies
* Ability to drive progress in an ambiguous environment with evolving needs
Why Tessolve
Join a global semiconductor solutions leader, where you’ll work on cutting‑edge packaging design projects across advanced technologies, collaborate with world‑class engineering teams, and help shape the future of semiconductor innovation.
Equal Opportunity Employer
Tessolve is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, veteran status, or any other protected characteristic.
Seniority level
Associate
Employment type
Full‑time
Job function
Design
Industries
Semiconductor Manufacturing
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$297,600.00- $402,600.00
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