Position
Senior Packaging Process Engineer at Compound Semiconductor Applications (CSA) Catapult
Location
Abercarn, Wales, United Kingdom
Responsibilities
* Lead multiple internal and external projects simultaneously, delivering technical work packages on time, to quality, and cost
* Coordinate other members of the engineering and technology teams as part of an integrated project team, providing technical guidance and instruction
* Prepare technical requirements, specifications, and test plans, and assist in delivery with other team members
* Develop packaging concepts into prototypes and validation
* Study assembly materials, applying the knowledge to develop advanced interconnects for next generation products
* Perform assembly, test and validation activities in the labs at CSA Catapult’s Innovation Centre
* Operate key assembly equipment, ownership and process development
* Technical reporting to the project team and a wider audience to demonstrate regular progress
* Consult with the Business Development team and customers to identify collaborative opportunities
* Plan projects, estimate resources to budget, and work on bids, technical proposals, and quotations, working closely with the bid team and commercial team
* Provide technical risk assessments
* Develop procedures and processes for assembly to ensure consistent standard of working across projects
* Develop new techniques to respond to the challenges generated during projects
* Present results and work to wide audiences to enhance the reputation of the catapult
Requirements
The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology, with prior relevant experience. They will exemplify the behaviours and values of the Catapult of collaboration, innovation, and trust.
* Demonstrable Semiconductor Packaging industry experience with strong microelectronics assembly, manufacturing process development, materials and testing knowledge
* Experience in one or more assembly techniques: wire bonding, die bonding and characterization
* Experience in multi-disciplinary engineering activities including design, test, manufacture, and instrumentation development
* Demonstrable experience in working on developing products, projects, and work packages, ideally across a multitude of different markets
* Excellent verbal and written communication skills in English
* Excellent team working skills with the proven ability to work collaboratively and cooperatively with colleagues
* Proven analytical and problem-solving skills, including the ability to quickly understand complex issues and to propose solutions
* Experience in presenting work to customers and wider audiences
* System integration and engineering approach to projects
* Familiarity with engineering lifecycle management
* 8D problem-solving methodology
* Experience in translating research output into working prototypes
* Proficient in Microsoft Office products
* Skills in data analytics, familiar with Matlab, Python and other programming skills
* System design and co-design approach
Other information
* Up to £63,960 salary (FTE)
* A non-contractual bonus scheme to allow everyone to share in our success
* Life Assurance – 4 times your annual salary
* Scottish Widows pension scheme – you put in 5% and we’ll put in 10%
* 28 days leave in addition to 8 bank holidays
* 37.5 hour full time working week
* A generous private medical insurance scheme for you and your family (enrolment once a year)
* A cashback scheme for your eye tests and dental treatment
* Payment for a professional membership each year
* Holiday purchase scheme (enrolment once a year)
* Flexible working – core hours of 10-4 with flexible balance of hours
* Electric Vehicle and Cycle to work schemes
Seniority level
* Mid-Senior level
Employment type
* Full-time
Job function
* Engineering and Research
Industries
* Research Services and Semiconductor Manufacturing
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