CSA Catapult is seeking a Principal Semiconductor Packaging Engineer to lead and architect cutting-edge 3D and 2.5D semiconductor packaging technologies, including advanced interconnects, system-in-package (SiP), chiplet integration, and high-bandwidth interface packaging. This is a strategic technical role combining deep packaging expertise with systems-level design thinking to define and deliver next-generation packaging platforms.
As a senior technical authority, you will lead internal and collaborative R&D programs and interface with global industry and academic partners to deliver packaging solutions for heterogeneous integration, targeting applications in AI, HPC, power electronics, RF, and photonics. You will be expected to provide design expertise on projects, analysis, assembly, and technical guidance on test and validation activities, participating in labs at Catapult’s Innovation Centre.
This position drives all packaging aspects of prototype/product development by charting and enabling packaging technology roadmaps in collaboration with internal and external stakeholders.
Key tasks include:
1. Architect and deliver cutting-edge packaging solutions for heterogeneous integration.
2. Serve as a solution architect for 3D and 2.5D packaging platforms, resolving system-level packaging challenges from concept design through to prototype and demonstrator builds.
3. Lead the definition, design, and development of advanced packaging solutions incorporating substrates, interposers, chiplets, high-density interconnects, microbump/UCIe interfaces, TSVs, and hybrid bonding for various applications including automotive, telecom, and photonics.
4. Resolve complex semiconductor packaging challenges from customer requirement analysis to package design, assembly, and validation as a solution architect.
5. Support planning and development of technical strategies and roadmaps aligned with Catapult’s themes and technological interests.
6. Lead multiple projects simultaneously, working closely with the Project Manager to meet system requirements and customer needs.
7. Coordinate technical work packages, interacting with packaging design, substrate, assembly, and thermal teams.
8. Engage in hands-on prototyping and lab validation using CSA’s Innovation Centre capabilities.
9. Design and develop advanced microelectronics modules/systems and demonstrators using a combination of technologies.
10. Provide technical guidance on design, assembly, test, and validation activities, participating in lab activities at CSA Catapult’s Innovation Centre as needed.
11. Report technical progress to project teams and broader audiences.
12. Consult with Business Development and customers to identify collaborative opportunities.
13. Plan projects, estimate resources and budgets, and contribute to bids, proposals, and quotations in collaboration with bid and commercial teams.
14. Review technical risk assessments.
15. Work with the Head of Packaging to ensure team alignment with company strategy.
16. Act as a strategic thinker for developing new and emerging technologies.
17. Represent CSA Catapult in collaborative consortia and client engagements, presenting technical strategies and innovation value.
18. Participate in bid preparation, resource planning, and stakeholder engagement with business development and commercial teams.
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