My client is looking for a Senior Packaging Process Engineer, to be an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems.
This is an onsite position based in Wales.
Responsibilities
* Develop advanced packaging assembly processes including 2.5D and 3D integration
* Design and validate high-speed interconnect solutions for system-in-package platforms
* Define interconnect schemes including flip chip, wafer-level packaging and hybrid bonding
* Develop process flows covering die attach, underfill, bonding and encapsulation
* Lead design-for-manufacturing activities with internal and external teams
* Run DOEs, reliability testing, failure analysis and process control
* Work with suppliers, partners and customers to evaluate materials and equipment
* Support lab-based activities including process characterisation and prototyping
* Lead technical projects and contribute to proposals and funding activities
* Provide technical guidance across multidisciplinary engineering teams
Requirements
* Strong experience in semiconductor packaging and microelectronics assembly
* Hands-on experience with 2.5D/3D integration, hybrid bonding and SiP
* Knowledge of TSV, RDL and wafer-level packaging processes
* Experience leading R&D or packaging development projects
* Understanding of electrical, thermal and system-level integration challenges
* Familiarity with cleanroom environments and process control methods
* Strong problem-solving and analytical capability
* Ability to work across multidisciplinary teams
Benefits
* Competitive salary
* Life Assurance – 4 times annual salary
* 15% pension
* 28 days annual leave in addition to bank holidays
* Private medical insurance for you and your family
* Visa Sponsorship and financial relocation assistance
* Flexible working hours
#J-18808-Ljbffr