My client is seeking a Senior Packaging Process Engineer with strong expertise in 3D semiconductor integration and high-density interconnects. This is an onsite position, based in Wales.
The role focuses on developing and validating 2.5D/3D packaging solutions, including fine-pitch interposers, advanced substrates, TSVs, and heterogeneous system-in-package (SiP) architectures. A key requirement is hands-on experience with integration and die bonding.
Responsibilities:
* Develop and lead 3D/2.5D advanced packaging processes using high-density interconnects
* Define and validate packaging process flows in collaboration with electrical and system designers
* Support package–silicon co-design, including signal and power integrity considerations
* Lead prototyping, troubleshooting, and process optimisation activities
Key requirements:
* Hands-on experience with 3D/2.5D integration and die bonding
* Experience in designing and developing new advanced assembly processes
* Strong understanding of electrical design considerations for advanced packaging
* Background in advanced assembly, bonding, and packaging process development
* Ability to lead technical work and collaborate across multidisciplinary R&D teams
Benefits:
* Competitive salary with annual performance bonus
* 15% pension (10% employer contribution)
* Private medical and dental insurance extended to family
* Life assurance at 4× annual salary
* Visa sponsorship and financial relocation assistance
If you are interested, please contact Ella Flynn @ IC Resources