This role involves supporting, maintaining, and improving wafer-level test equipment within a cutting-edge micro-LED R&D environment. You will be responsible for maximising equipment uptime, resolving hardware and software issues, performing scheduled maintenance and calibration, and driving continuous improvement.
The position also requires close collaboration with vendors and cross-functional teams to optimise wafer test performance and support equipment used in wafer-coring processes. The working pattern is Monday - Friday, 8:00 - 4:30, with occasional extended hours to meet critical deadlines.
Key Responsibilities
* Maintain, troubleshoot, and repair wafer probers and test equipment.
* Perform equipment setup, calibration and configuration of test instruments, probe cards, and test interfaces.
* Manage test equipment maintenance and vendor, tooling, and spare parts.
* Monitor equipment performance and implement improvement actions to enhance tool uptime, throughput, and quality.
* Support the execution of equipment qualification activities, evaluation and scheduled maintenance.
* Analyse test data to identify equipment-related yield issues and implement fixes.
* Collaborate with customers and vendors for equipment requirement and upgrade/modification to enable wafer testing capabilities.
* Create and maintain equipment documentation and standard operating procedures.
* Ensure quality and safety standards and procedures are implemented on the defined equipment set.
* Provide technical training and support to shift engineers.
Experience & Attributes
* A minimum HNC in Electrical or Electronic or Mechanical Engineering is preferred or suitable experience.
* Minimum 5 years of experience in wafer test equipment engineering.
* Hands-on experience with wafer probers (TEL and FormFactor platforms) or automated test equipment (Teradyne platform).
* Good knowledge of electrical and mechanical systems, troubleshooting and fault rectification methods.
* Strong commitment, analytical, problem-solving skills, and continuous improvement mindset.
* Ability to multi-task and work safely and effectively without close supervision.
* Understand SPC, DOE, FMEA, OCAP and data analysis methodologies.
Advantage
* Knowledge on wafer coring equipment such as wafer mounter, dicing and backgrind.