Overview Develop thin film deposition processes including metal, dielectric and semiconductors for Pragmatic's flexible IC production. One important task will be to improve existing processes, moving them from development into mass manufacturing, demonstrating acceptable performance via Cp/CpK, throughput and defectivity, on Pragmatic's recently installed 300mm wafer production line. Further activities will centre upon the development of similar but more advanced processes, in tandem with the Research team, to rapidly establish manufacturable paths to next-generation flexible IC devices. Key tasks Optimise TFT Barrier Layer deposition process, whilst delivering aggressive throughput and quality improvements. Develop semiconductor deposition to meet TFT performance consistency at scale. Improve resistor layer performance uniformity, and in consort with vendors, develop next-generation hardware to provide robust deposition solutions for advanced tech nodes. Establish comprehensive characterisation of sputtered films and devise introductory process controls for current and new processes. Train a PVD engineer to support the above tasks. Qualifications and training Degree in Physical Sciences, Electronics Engineering PhD with an emphasis on practical micro/nanoscale device fabrication is preferred although not essential. Microsoft. SQL/databases, 6-sigma Skills and experience Previous experience of Micro-electronics fabrication, particularly in vacuum deposition of thin films Good knowledge and experience of characterisation techniques for microstructure fabrication, such as semiconductor, AFM, Surface Profilometery, Ellipsometry Excellent knowledge of Physical Vacuum Deposition techniques including especially plasma-based methods. Good track record of industrial experience in device fabrication process development. Competence at efficient experimental practise and design techniques