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Memory team - physical design engineer

Market Drayton
SAMSUNG
Design engineer
Posted: 21 June
Offer description

Position Summary

Complex SOC Top Physical Implementation for next generation SoCs
by means of Synthesis, Place and Route, STA, timing and physical signoffs

Role and Responsibilities

- Hands on experience doing physical design and timing closure of complex blocks and full-chip designs

- Should have strong understanding of timing, power and area trade-offs and optimization of PPA

- Power user of industry standard tools (ICC/DC/PT/VSLP/Redhawk/Calibre/Formality) and able to understand their capabilities

- Should have solid understanding of scripting languages such as Perl/Tcl and implementation flows

- Experience with large SOC designs (>20M gates) with frequencies in excess of 1GHZ .

- Expertise in block level and full-chip SDC cleanup, Synthesis optimization, Low Power checking and logic equivalence checking

- Familiar with deep sub-micron designs (8nm/5nm) and associated issues (manufacturability, power, signal integrity, scaling)

- Familiar with typical SoC issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.

- Familiar in hierarchical design, top-down design, budgeting, timing and physical convergence

Skills and Qualifications

- Experience in top level floorplanning including partition shaping and sizing, pin placement, channel planning,

high speed signal and clock planning and feed-through planning is a plus

- Good understanding of Physical Design Verification methodology to debug LVS/DRC issues at chip/block level

- Should have gone through 4+ recent successful SoC tape-outs

- Should have 8 ~ 14 years of experience in physical implemenation and design

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