My client is seeking a Senior Packaging Process Engineer with strong expertise in 3D semiconductor integration and high-density interconnects. This is an onsite position, based in Wales. The role focuses on developing and validating 2.5D/3D packaging solutions, including fine-pitch interposers, advanced substrates, TSVs, and heterogeneous system-in-package (SiP) architectures. A key requirement is hands-on experience with integration and die bonding. Responsibilities: Develop and lead 3D/2.5D advanced packaging processes using high-density interconnects Define and validate packaging process flows in collaboration with electrical and system designers Support package–silicon co-design, including signal and power integrity considerations Lead prototyping, troubleshooting, and process optimisation activities Key requirements: Hands-on experience with 3D/2.5D integration and die bonding Experience in designing and developing new advanced assembly processes Strong understanding of electrical design considerations for advanced packaging Background in advanced assembly, bonding, and packaging process development Ability to lead technical work and collaborate across multidisciplinary R&D teams Benefits: Competitive salary with annual performance bonus 15% pension (10% employer contribution) Private medical and dental insurance extended to family Life assurance at 4× annual salary Visa sponsorship and financial relocation assistance If you are interested, please contact Ella Flynn @ IC Resources