Job Description
We exclusively represent a global leader in power semiconductor manufacturing who is seeking to expand its module engineering team due to the continued growth of the business.
The business operates in diverse marketplaces, meaning its commercial successes are spread and not siloed to one industry. They sell into renewables, rail, HVDC and automotive marketplaces worldwide.
The position is located on-site at their global Research and Development centre.
The position will expose you to leading-edge WBG and UWBG technology in addition to legacy, yet still very relevant technologies.
The required skillset is below:
* Design of power modules incorporating wide band gap semiconductors, for example GaN & SiC devices
* Embedded devices within multi-layer PCB stacks
* Optimising performance and switching performance by analysing magnetics, thermal characteristics, and EMI profiles
* Design and layout of high-power circuits taking into consideration commutation loop inductance minimisation, gate loop inductance minimisation and balancing, current sharing between devices and the minimisation of electromagnetic interference.
* System architecture mindset and experience
* Design for manufacture mindset and experience
* FEM software knowledge (ANSYS Mechanical and Q3D) and circuit simulation software (LTSpice, PLECS)