Job Title: IC Package Designer
Location: Cambridge, UK
Contract Type: Long:term Contract
We are seeking an experienced IC Packaging Designer to join our clients team in Cambridge. This role offers the opportunity to develop creative, cost:effective, and high:performance IC packaging designs for cutting:edge semiconductor applications.
Key Responsibilities:
:Create netlists and BGAs according to project requirements.
:Conduct feasibility studies to recommend optimal pad layouts, interconnect types, and substrate parameters for specific IC devices or applications.
:Define substrate stack:ups, routing strategies, and via structures.
:Design substrates for RF, digital, high:speed, and mixed:signal dies.
:Ensure signal integrity (SI) and power integrity (PI) requirements for high:speed interfaces (DDR, SERDES, etc.).
:Work with UCIE:Advanced, standard technologies, and HBM technologies.
:Set design rule checks (DRC) to ensure layouts meet manufacturing, assembly, and design guidelines.
:Optimize die breakout for signals and create patterns for high:power applications.
:Apply expertise in HDI substrate technologies, layout rules, and materials for optimal electrical, thermal, mechanical, and manufacturability performance.
:Demonstrate knowledge of different package types and OSAT design rules.
:Design wire bond and flip:chip substrates, including advanced packaging technologies such as 2.5D, 3D, RDL, and embedded passives.
:Strong experience with CoWoS (Chip:on:Wafer:on:Substrate) interposer design and understanding of substrate impact on CoWoS performance.Qualifications and Experience:
:Bachelor's degree in Electronics or Electrical Engineering.
:3:8+ years of experience in IC package design and development.
:Proficiency in Cadence Allegro Package Designer.
:Hands:on experience in wire bond, flip:chip, and advanced packaging technologies.
Please get in touch with Christina McGuire to hear more