Job Description
Salary range:£46,735 - £57,422
FTE:1 (35 hours per week)
Term:Open-ended
Closing date:13 June 2025
The University has been successful in attracting capital support for the establishment of an Advanced Semiconductor Packaging Line (ASPL), based within our new facility close to Glasgow Airport. The line is one of a kind as it has been designed to allow for a broad range of present and future devices. Its open access governance model is unique in Europe and very rare elsewhere. NMIS is seeking to appoint a Laboratory Manager to manage the ASPL cleanroom facilities, encompassing multiple cells for the packaging of semiconductors. The ASPL will explore and develop disruptive packaging and integration technologies to make next- systems at lower cost and with more energy and packaging efficiency.
The ASPL Laboratory Manager will lead a multidisciplinary team of Process Engineers, researchers, and technicians, with responsibility for the strategic development and operational leadership of the cleanroom facility. You will shape the long-term direction of the ASPL, contributing to institutional strategies and influencing policy decisions related to advanced semiconductor packaging and laboratory operations. This includes oversight of operational planning, resource allocation, equipment lifecycle and capital planning, and ensuring compliance with Health and Safety, Quality, and regulatory standards. You will play a key role in enabling and supporting high-impact research and industrial programmes.
The ASPL Laboratory Manager will collaborate closely with academic, research, and engineering staff to lead the development of advanced semiconductor packaging processes, including design, assembly, testing, and validation. You will act as a key advisor on the specification and procurement of capital equipment, ensuring alignment with both technical and strategic growth priorities. In this role, you will provide expert guidance on multidisciplinary technical challenges and contribute to the integration of novel technologies and methods. A strong understanding of semiconductor packaging, along with an appreciation of related technologies and engineering design principles, is highly desirable.
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