My client is seeking a Principal Packaging Engineer to lead the design and development of cutting-edge advanced packaging technologies. What You’ll Do Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype Oversee design, assembly, testing, and validation of advanced packaging demonstrators Define technology roadmaps and guide multiple packaging projects. Collaborate with internal and external teams to solve system-level integration challenges Represent the company in technical forums, proposals, and collaborative bids About You Proven experience in advanced semiconductor packaging – 3D/2.5D Strong, extended knowledge of design, modelling, assembly, and validation processes Skilled in signal/power integrity and thermal management Excellent communication, leadership, and problem-solving skills Track record of delivering demonstrators and leading cross-functional teams Benefits Include Lucrative salary up to mid £70k 15% pension (10% employer) Annual bonus Private medical insurance extended to family Visa sponsorship and offer up to £5000 relocation fees If you’re looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources